99.7% Alumina Ceramic Wafer Polishing Plate | RFQ Sourcing Details
Adsorbents · Quote on request
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Product specs
Buyer's Digest
Use this page as a product-first sourcing checkpoint before sending an RFQ. Category: Adsorbents. Confirm application fit, capacity, materials, destination, lead time and compliance requirements before comparing suppliers.
Original product description
99.7% alumina Ceramic Wafer Polishing Plate 99.7% Alumina Wafer Polishing Plate / Turn Table >>> Application: Chemshun Ceramics 99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing. As an important component of CMP chemical mechanical polishing process.
CMP is the necessary for producing process of the sapphire and Wafer of the semiconductors. Chemshun Ceramics' high purity 99.7 % alumina ceramics sapphire polishing and lapping plates, Disc are shaped as PIBM producing process. Its an internaltional advanced technology.
PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics.
>>> The Process Photo of CMP: >>> Features of Chemshun Ceramics 997 Alumina Ceramic Polishing Plate : High Purity Alumina High rigidity (Hardness, Mechanical Strength, Flexural Strength, Wear Resistance) High chemical durability Surface shape & roughness control For Wide Variation of wafer size & Thickness Ability to Resist the Severe Microchip-processing equipment environment High Quality & Pretty Price Compare to Japane Alumina Polishing Plate >>> Size: Disc, ring size below ∅850mm, thickness 45mm.
For example: D150mm, D360mm,D 600mm. Customized products with various size are accepted.
>>> Main Parameter : Unit Chemshun 99.7 Alumina Ceramics General Properties Al2O3 content wt% Density gm/cc Color - Ivory Water absorption % 0 Mechanical Properties Flexural Strength(MOR) 20 ºC Mpa(psix10^ Elastic Modulus 20 ºC GPa (psix10^6) 375 Vickers Hardness Gpa(kg/mm2) R45N >=17 Bending Strength Gpa 390 Tensile Strength 25 ºC MPa(psix10^3 ) 248 Fracture Toughness (K I c) Mpa* m^1/2 4-5 Thermal Properities Thermal conductivity(20 ºC ) W/mk 30 Coefficient of Thermal expansion(25-1000 ºC ) 1x 10^-6/ ºC 7.6 Thermal Shock Resistance ºC 200 Maximum use temperature ºC 1700 Electrical Properities Dielectric Strength (1MHz ) ac-kv/mm(ac v/mil) 8.7 Dielectric Constant(1 MHz) 25 ºC 9.7 Volume Resistivity ohm-cm (25 ºC ) >10^14 ohm-cm (500 ºC ) 2x10^12 ohm-cm (1000 ºC ) 2x10^7
99.7% | Applications and Buyer Notes
99.7% is organized as a sourcing-ready Adsorbents reference. The page combines visible product or company data with structured procurement cues so buyers can compare application fit, specifications, quantity, quality requirements and lead-time questions before
Applications
- Initial shortlist building for related product or supplier options.
- Specification and application fit review before bulk purchasing.
- Category, keyword and detail-page comparison before sending an RFQ.
Key specifications
- Category
- CO2 AdsorbentsBased on visible page data; confirm exact value in the RFQ.
- Unit
- setBased on visible page data; confirm exact value in the RFQ.
- Application
- SemiconductorBased on visible page data; confirm exact value in the RFQ.
- Disc Diameter
- Within 850mmBased on visible page data; confirm exact value in the RFQ.
- Disc(Wheel) Type
- Polishing PlateBased on visible page data; confirm exact value in the RFQ.
- Material
- Alumina CeramicsBased on visible page data; confirm exact value in the RFQ.
- Model NO.
- Chemshun CeramicBased on visible page data; confirm exact value in the RFQ.
- Object
- WaferBased on visible page data; confirm exact value in the RFQ.
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FAQ
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Can buyers inquire when specs are incomplete?
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Check title, category, specifications and related keywords against the actual sourcing requirement.
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Key specifications
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